ARCHICOM SA (36/2018) Change of the Bond Issue Program

The Management Board of ARCHICOM S.A. with its registered office in Wrocław (hereinafter referred to as the "Company") in reference to the current report No. 21/2016 of 17.06.2016 and 09/2017 of 06/03/2017, informs that on 4 July 2018 the contract was changed with mBank SA regarding the bond issue program of June 17, 2016 (hereinafter referred to as the "Bond Issue Program"). The change consists in increasing the maximum admissible total value of issued bonds from the amount of PLN 115.000.000 (say: one hundred and fifteen million zlotys) to the amount of PLN 250,000,000 (in words: two hundred and fifty million zlotys).
Other important provisions of the Bond Issue Program remain unchanged.
The issues of individual series of bonds as part of the Bond Issue Program will be announced by the Company in subsequent current reports.

Source: company website, investor relations, current and periodic reports.

Company information
Company name:Archicom SA
Adress: ul. Liskego 7 50-345 Wrocław
Phone:+48 71 7858800

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