Announcement.

ARCHICOM SA (37/2020) Information on the change of the Bond Issue Terms A1 / 2020, A2 / 2020, A3 / 2020, A4 / 2020

Management Board of ARCHICOM S.A. ("Company") with reference to the current report No. 33/2020 of June 29, 2020, informs that on July 30, 2020, the Company concluded an agreement with SGB-BANK S.A. based in Łódź ("Bank"), a conversion agreement changing the Terms and Conditions for the Issue of Series A1 / 2020, A2 / 2020, A3 / 2020 and A4 / 2020 ("Agreement") with regard to changing the final maturity date of Series A1 / 2020 and A2 / 2020. The agreement comes into force on July 31, 2020.
The agreement was concluded as a result of a contradiction in the text of the Terms and Conditions of the Bonds Issue, resulting from an incorrect entry. In order to remove the doubts arising from them, it was decided to regulate the legal relationship between the Company and the Bank with regard to the issued bonds by introducing corrected provisions to the Terms and Conditions of Bonds Issue regarding redemption dates and interest periods.
Current final maturity date of the Bonds:
A1 / 2020 - December 31, 2022
A2 / 2020 - September 30, 2022
A3 / 2020 - September 30, 2022 < br /> A4 / 2020 - December 31, 2022
The other Terms and Conditions of the Bonds Issue remain unchanged.

Source: company website, investor relations, current and periodic reports.

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Company information
Company name:Archicom SA
ISIN:PLARHCM00016
NIP:8982100870
Adress: ul. Liskego 7 50-345 Wrocław
Phone:+48 71 7858800
website:www.archicom.pl

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